Not much. HBM will not gain much from going inside the chip pachage over existin... | Hacker News

Hacker News new | past | comments | ask | show | jobs | submit

login

baybal2 on Nov 28, 2020 | parent | context | favorite | on: TSMC: SoIC

Not much. HBM will not gain much from going inside the chip pachage over existing interposer solution.

baybal2 on Nov 28, 2020 [–]

Though, you may decide foregoing the interposer. This way, money go TSMC instead of interposer maker, which was already likelly been TSMC.

Consider applying for YC's Spring batch! Applications are open till Feb 11.
Guidelines | FAQ | Lists | API | Security | Legal | Apply to YC | Contact